The iPhone 18 Pro series has undergone major changes this year, as reported by insider Digital Chat Station.
Specifications of the motherboard and factory data have been leaked online. The key improvement is a significant upgrade to the heat dissipation system—it no longer uses a two-layer motherboard with a single-chip system sandwiched between the layers.
The insider added that the A20 Pro utilizes WMCM technology, which could lead to a noticeable boost in performance. WMCM (Wafer-Level Multi-Chip Module) is a semiconductor packaging method developed by TSMC. It integrates multiple chips—such as the processor, graphics, memory, and AI chip—into a single unit at an early stage of production.
Previously, Digital Chat Station was the first to accurately disclose the specifications of the Xiaomi 15 and Xiaomi 15 Pro, as well as the news that the Realme GT 7 Pro will feature a bright Samsung display and that the Dimensity 9400 SoC will launch before the Snapdragon 8 Elite.
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